GDS-3 initiative: advanced design-through-chip infrastructure for subwavelength technology

GDS-3 initiative: advanced design-through-chip infrastructure for subwavelength technology

Author(s):

Pack, R.C. ( Cadence Design Systems, Inc. (USA) )

Heins, M.D.

Chatila, A.R. ( Cypress Semiconductor Corp. (USA) )

Boksha, V.V. ( Boksha Global Partners (USA) )

Cottrell, D. ( Silicon Integration Initiative, Inc. (USA) )

Berglund, C.N. ( Northwest Technology Group (USA) )

Hogan, J. ( Cadence Design Systems, Inc. (USA) )

Publication title:

Design, process integration, and characterization for microelectronics : 6-7 March 2002, Santa Clara, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4692

Pub. Year:

2002

Page(from):

566

Page(to):

584

Pages:

19

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819444394 [0819444391]

Language:

English

Call no.:

P63600/4692

Type:

Conference Proceedings

Details

TDL ID:	ZA00012527
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Design, process integration, and characterization for microelectronics
Conf. info. (Number):	2002
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2002.03.06-2002.03.07

Similar Items:

1 Conference Proceedings Silicon economics (Invited Paper) Hogan, J., Chatila, A.R., Bruggeman, B., Boksha, V.V. SPIE-The International Society for Optical Engineering	7 Technical Paper Investigation of advanced fault insertion and simulator methods Dunn, W. R., Cottrell, D. National Aeronautics and Space Adminstration
2 Conference Proceedings Design process optimization, virtual prototyping of manufacturing, and foundry-portable DFM(Invited Paper) Hogan, J., Progler, C., Chatila, A., Bruggeman, B., Heins, M., Pack, R., Boksha, V. SPIE - The International Society of Optical Engineering	8 Conference Proceedings UNITED STATES STATE AND FEDERAL GOVERNMENTS: ENHANCING ECONOMIC COMPETITIVENESS THROUGH COLLABORATION COBURN, C., BERGLUND, D., USHER, R. Kluwer Academic Publishers
3 Conference Proceedings Physical and timing verification of subwavelength-scale designs: I. Lithography impact on MOSFETs Pack, R.C., Axelrad, V., Shibkov, A., Boksha, V.V., Huckabay, J.A., Salik, R., Staud, W., Wang, R., Grobman, W.D. SPIE-The International Society for Optical Engineering	9 Conference Proceedings Trends in systematic nonparticle yield loss mechanisms and the implication for IC design Berglund, C.N. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Modeling in-pack chemical transformations Bales C. R. Springer-Verlag	10 Conference Proceedings Trends in systematic nonparticle yield loss mechanisms and the implications for IC design Berglund, C.N. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Building an infrastructure for parametric yield analysis: concept and implementation of a DFM platform(Invited Paper) Gookassian, J., Pack, B., Heins, M., Garcia, J., Divecha, H., Gordon, B., Frazier, D., White, D., Lachinyan, G., Dillon, … SPIE - The International Society of Optical Engineering	11 Conference Proceedings Comparison of different optical proximity correction models with three-dimensional photolithography simulation over planar substrates (Invited Paper) Rey,J.C., Li,J., Boksha,V.V., Bernard,D.A. SPIE-The International Society for Optical Engineering
6 Conference Proceedings Advanced simulation techniques for thick photoresist lithography Flack,W.W., Newman,G., Bernard,D.A., Rey,J.C., Granik,Y., Boksha,V.V. SPIE-The International Society for Optical Engineering	12 Conference Proceedings Model-based optical proximity correction including effects of photoresist processes Li,J., Bernard,D.A., Rey,J.C., Boksha,V.V. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12