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Integration of new alignment mark designs in dual inlaid-copper interconnect processes

Author(s):
Warrick, S.P. ( Motorola (USA) )
Hinnen, P.C. ( ASML (Netherlands) )
van Haren, R.J.
Smith, C.J. ( Motorola (USA) )
Megens, H.J. ( ASML (Netherlands) )
Fu, C.-C. ( Motorola (USA) )
1 more
Publication title:
Optical Microlithography XV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4691
Pub. date:
2002
Vol.:
Part Two
Page(from):
971
Page(to):
980
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819444370 [0819444375]
Language:
English
Call no.:
P63600/4691
Type:
Conference Proceedings

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