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Contact hole resolution enhancement by post exposure amine treatment (CONPEAT) process

Author(s):
Koh, C.-W. ( Hynix Semiconductor, Inc. (Korea) )
Kim, J.-S.
Choi, C.-I.
Eom, T.-S.
Kwon, W.-T.
Jung, J.-C.
Bok, C.-K.
Shin, K.-S.
3 more
Publication title:
Advances in Resist Technology and Processing XIX
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4690
Pub. date:
2002
Vol.:
Part Two
Page(from):
793
Page(to):
798
Pages:
6
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819444363 [0819444367]
Language:
English
Call no.:
P63600/4690
Type:
Conference Proceedings

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