Comparison of ATHENA and TTL alignment capability in product wafers

Comparison of ATHENA and TTL alignment capability in product wafers

Author(s):

Opitz, J. ( Integrated Device Technology, Inc. (USA) )
Laidler, D. ( IMEC (Belgium) )

Publication title:

Metrology, Inspection, and Process Control for Microlithography XVI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4689

Pub. Year:

2002

Vol.:

Part Two

Page(from):

852

Page(to):

862

Pages:

11

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819444356 [0819444359]

Language:

English

Call no.:

P63600/4689

Type:

Conference Proceedings

Details

TDL ID:	ZA00012522
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology, inspection, and process control for microlithography
Conf. info. (Number):	2002 : 16th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2002.03.04-2002.03.07

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