Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan (Invited Paper)

Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan (Invited Paper)

Author(s):

Washio, K. ( NEC Corp. (Japan) )
Kouta, H.

Publication title:

Photon Processing in Microelectronics and Photonics

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4637

Pub. date:

2002

Page(from):

561

Page(to):

570

Pages:

10

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819443762 [081944376X]

Language:

English

Call no.:

P63600/4637

Type:

Conference Proceedings

Details

TDL ID:	ZA00012465
Series ID:	PA00000029
Conf. info. (Name):	SPIE LASE : Photon processing in microelectronics and photonics
Conf. info. (Number):	2002
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2002.01.21-2002.01.24

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