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Overview and future prospects of the use of lasers for packaging by the microelectronics and photonics industry in Japan (Invited Paper)

Author(s):
Publication title:
Photon Processing in Microelectronics and Photonics
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4637
Pub. date:
2002
Page(from):
561
Page(to):
570
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819443762 [081944376X]
Language:
English
Call no.:
P63600/4637
Type:
Conference Proceedings

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