Effects of etching time and wafer miscut on the morphology of etched Si(111) surfaces

Effects of etching time and wafer miscut on the morphology of etched Si(111) surfaces

Author(s):

Zhou, H. ( National Institute of Standards and Technology (USA) )
Fu, J.
Gonda, S.
Silver, R.M.

Publication title:

Nanostructure Science, Metrology, and Technology

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4608

Pub. Year:

2002

Page(from):

168

Page(to):

175

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819443472 [0819443476]

Language:

English

Call no.:

P63600/4608

Type:

Conference Proceedings

Details

TDL ID:	ZA00012436
Series ID:	PA00000029
Conf. info. (Name):	Nanostructure science, metrology, and technology
Conf. info. (Number):	2001
Conf. info. (Venue):	Gaithersburg, USA
Conf. info. (Date):	2001.09.05-2001.09.07

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