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Novel wafer-through technique for interconnects

Author(s):
Publication title:
Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4593
Pub. Year:
2001
Page(from):
274
Page(to):
282
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819443236 [0819443239]
Language:
English
Call no.:
P63600/4593
Type:
Conference Proceedings

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