Novel wafer-through technique for interconnects
- Author(s):
- Kutchoukov, V. G. ( Delft Univ. of Technology (Netherlands) )
- Mollinger, J.R.
- Bossche, A.
- Publication title:
- Design, characterization, and packaging for MEMS and microelectronics II : 17-19 December, 2001, Adelaide, Australia
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4593
- Pub. Year:
- 2001
- Page(from):
- 274
- Page(to):
- 282
- Pages:
- 9
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819443236 [0819443239]
- Language:
- English
- Call no.:
- P63600/4593
- Type:
- Conference Proceedings
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