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Low Cost Solder Bumping via Paste Reflow for Area Array Packages

Author(s):
Publication title:
Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4587
Pub. Year:
2001
Page(from):
111
Page(to):
126
Pages:
16
Pub. info.:
Washington, DC: IMAPS
ISSN:
0277786X
ISBN:
9780930815646 [0930815645]
Language:
English
Call no.:
P63600/4587
Type:
Conference Proceedings

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