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Packaging issues using FEA and experimental verification on a Si-based capacitive microrelay

Author(s):
Publication title:
Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Trancisco, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4558
Pub. Year:
2001
Page(from):
226
Page(to):
233
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819442864 [0819442860]
Language:
English
Call no.:
P63600/4558
Type:
Conference Proceedings

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