Blank Cover Image

Engineering in-and out-of-plane stress in PECVD silicon nitride for CMOS-compatible surface micromachining

Author(s):
Publication title:
Micromachining and microfabrication process technology VII : 22-24 October 2001, San Francisco, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4557
Pub. Year:
2001
Page(from):
320
Page(to):
328
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819442857 [0819442852]
Language:
English
Call no.:
P63600/4557
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Control of Stress in a Metal-Nitride-Metal Sandwich for CMOS-Compatible Surface Micromachining

Davies, Rhodri R., Combes, David J., McNie, Mark E., Brunson, Kevin M.

Materials Research Society
7 Conference Proceedings Stress-induced curvature engineering in surface-micromachined devices

Aksyuk,V.A., Pardo,F., Bishop,D.J.

SPIE - The International Society for Optical Engineering
2 Conference Proceedings CMOS compatibiltity of high-aspect-ratio micromachining (HARM) in bonded silicon-on-insulator (BSOI)

McNie,M.E., King,D.O.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings A CFD MODEL FOR THE PECVD OF SILICON NITRIDE

Collins, D.J., Strojwas, A.J., White, D.

Electrochemical Society
3 Conference Proceedings Large deflection of out-of-plane magnetic actuators using surface micromachining

Huang,J.-M., Liew,K.M., Liu,A.Q.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Stress Modulation of PECVD Silicon Nitride

M. Balseanu, L. Q. Xia, V. Zubkov, M. Le, J. Lee, H. M'Saad

Electrochemical Society
4 Conference Proceedings Designing manufacturable MEMS in CMOS-compatible processes: methodology and case studies

Schropfer, G., McNie, M., da Silva, M., Davies, R., Rickard, A., Musalem, F. -X.

SPIE - The International Society of Optical Engineering
10 Conference Proceedings Deposition Parameter Studies Of Silicon Nitride Films Prepared By PECVD Process And Their Applications To Surface Acoustic Wave Devices

Sundaram, K.B., Lee, R., Malocha, D.C., Hines, J.H.

Electrochemical Society
5 Conference Proceedings Stress Control of Si-Based PECVD Dielectrics

Mackenzie, K.D., Johnson, D.J., DeVre, M.W., Westerman, R.J., Reelfs, B.H.

Electrochemical Society
11 Conference Proceedings Source follower noise limitations in CMOS active pixel sensors

Findlater, K.M., Vaillant, J.M., Baxter, D.J., Augier, C., Herault, D., Henderson, R.K., Hurwitz, J., Grant, L.A., …

SPIE - The International Society of Optical Engineering
6 Conference Proceedings CMOS Compatible Silicon Micromachining Using TMAH

Bozeat, R.J., Bunyan, R.J.T., Nayar, V.

Electrochemical Society
12 Conference Proceedings A Correlation Between Film Property and Chemical Structure of PECVD Silicon Nitride Deposited on GaAs

J. W. Lee, K. I Cho, R. Ryoo, M. S. Jhon

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12