Wafer dicing by laser-induced thermal shock process

Wafer dicing by laser-induced thermal shock process

Author(s):

Ye,K. ( National Univ. of Singapore )
An,C.
Hong,M.
Lu,Y.

Publication title:

Micromachining and microfabrication process technology VII : 22-24 October 2001, San Francisco, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4557

Pub. Year:

2001

Page(from):

174

Page(to):

182

Pages:

9

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819442857 [0819442852]

Language:

English

Call no.:

P63600/4557

Type:

Conference Proceedings

Details

TDL ID:	ZA00012271
Series ID:	PA00000029
Conf. info. (Name):	Micromachining and Microfabrication : Micromachining and Microfabrication Process Technology
Conf. info. (Number):	2001 : 7th
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2001.10.22-2001.10.24

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