Novel Electroless Bumping Technologies for MCM-D: Bumping of Single Chips and Straight-Wall Bumping on Cu Metallisations

Novel Electroless Bumping Technologies for MCM-D: Bumping of Single Chips and Straight-Wall Bumping on Cu Metallisations

Author(s):

Pauw,Herbert De ( Ghent University / IMEC )
Vanfleteren,J.
Baets,J.De
Calster,A.Van

Publication title:

Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4428

Pub. Year:

2001

Page(from):

302

Page(to):

307

Pages:

6

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780930815639 [0930815637]

Language:

English

Call no.:

P63600/4428

Type:

Conference Proceedings

Details

TDL ID:	ZA00012142
Series ID:	PA00000029
Conf. info. (Name):	HD International Conference on High-Density Interconnect and Systems Packaging
Conf. info. (Number):	2001
Conf. info. (Venue):	Santa Clara, California, USA
Conf. info. (Date):	2001.04.17-2001.04.20

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