Blank Cover Image

Micro-moire methods: optical and scanning techniques

Author(s):
Publication title:
Optical engineering for sensing and nanotechnology (ICOSN 2001) : 6-8 June 2001, Yokohama, Japan
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4416
Pub. Year:
2001
Page(from):
54
Page(to):
57
Pages:
4
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819441218 [081944121X]
Language:
English
Call no.:
P63600/4416
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Development and application of micro-moire interferometer

Oh,K.E., Chai,G.B., Asundi,A.K., Chan,K.C., Chai,T.C.

SPIE - The International Society for Optical Engineering
7 Conference Proceedings Measurement of thermal deformation of IC packages using the AFM scanning moire technique

Zhong,Z., Lu,Y., Xie,H., Ngoi,B.K.A., Yu,J., Chai,J.B., Asundi,A.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings Measurement of residual in polymer composites using moire interferometry

Shankar,K., Xie,H., Asundi,A.K., Oh,K.E., Chai,G.B.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Photoelastic stress analysis of internal fixation techniques for femur shaft crack

Liu,T., Chai,G.B., Asundi,A.K., murugiah,A.

SPIE-The International Society for Optical Engineering
3 Conference Proceedings AFM scanning moire method for nanodeformation measurement

Xie,H., Chai,G.B., Asundi,A.K., Yu,J., Lu,Y., Ngoi,B.K.A., Zhong,Z., Kishimoto,S.

SPIE - The International Society for Optical Engineering
9 Conference Proceedings Thermal deformation of electronic package using scanning moire method with high-resolution microscopy

Asundi,A., Xie,H., Boay,C.G.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Micro/nano moire methods

Asundi, A.K., Shang, H., Xie, H., Li, B.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Grid method for strain measurement in electronic packaging using optical,electronic,and atomic force microscope

Zhao,B., Asundi,A.K., Oh,K.E.

SPIE - The International Society for Optical Engineering
5 Conference Proceedings Thermal deformation measurement of electronic packaging component using AFM scanning moire method

Hie,H., Chai,G.B., Asundi,A.K., Jin,Y., Lu,Y., Ngoi,B.K.A., Zhong,Z.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Phase-shifting AFM moire method

Asundi,A.K., Xie,H., Yu,J., Zhong,Z.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings High-resolution micro-moire methods: principles and applications

Asundi, A.K., Xie, H., Boay. C.G.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Micro-moire for thermal deformation investigation in electronics packaging

Zhong.Z.W., Lim, S.C., Asundi, A.K., Chai, T.C.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12