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"Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection"

Author(s):
Murakoshi,Y. ( National Institute of Advanced Industrial Science and Technology )
Shimizu,T.
Takagi,H.
Li,Y.
Uchino,K.
Yokoi,T.
Maeda,R.
2 more
Publication title:
Design, test, integration, and packaging of MEMS/MOEMS 2001 : 25-27 April 2001, Cannes, France
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4408
Pub. date:
2001
Vol.:
4408
Page(from):
502
Page(to):
509
Pages:
8
Pub. info.:
Bellingham, Washington: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819441096 [0819441090]
Language:
English
Call no.:
P63600/4408
Type:
Conference Proceedings

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