"Si-based multilayered print circuit board for MEMS packaging fabricated by Si deep etching, bonding, and metal powder injection"
- Author(s):
Murakoshi,Y. ( National Institute of Advanced Industrial Science and Technology ) Shimizu,T. Takagi,H. Li,Y. Uchino,K. Yokoi,T. Maeda,R. - Publication title:
- Design, test, integration, and packaging of MEMS/MOEMS 2001 : 25-27 April 2001, Cannes, France
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4408
- Pub. Year:
- 2001
- Page(from):
- 502
- Page(to):
- 509
- Pages:
- 8
- Pub. info.:
- Bellingham, Washington: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819441096 [0819441090]
- Language:
- English
- Call no.:
- P63600/4408
- Type:
- Conference Proceedings
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