Blank Cover Image

Coplanar waveguides on SOI and OPS substrates

Author(s):
Gamble,H.S. ( Queen's Univ. of Belfast )
Leong,K.O.
Raza,S.H.
Armstrong,B.M.
Mitchell,S.J.N.
Yang,S.
Fusco,V.F.
Stewart,J.A.C.
3 more
Publication title:
MEMS design, fabrication, characterization, and packaging : 30 May-1 June 2001, Edinburgh, UK
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4407
Pub. Year:
2001
Page(from):
363
Page(to):
371
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819441089 [0819441082]
Language:
English
Call no.:
P63600/4407
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Fabrication of Sub-micron Active Layer SSOI Substrates using Ion Splitting And Wafer Bonding Technologies

Ruddell, F., Bain, M., Suder, S., Hurley, R.E., Armstrong, B.M., Fusco, V.F., Gamble, H.S.

Electrochemical Society
7 Conference Proceedings Flow-rate measurement via conductivity monitoring in microfluidic devices

Rainey,P., Mitchell,S.J.N., Gamble,H.S.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings Electrostatic Bonding for Silicon on Glass Applications

Baine, P.T., Quinn, L.J., Lee, B., Mitchell, S.J.N., Gamble, H.S., Armstrong, B.M.

Electrochemical Society
8 Conference Proceedings LARGE-GRAIN POLYSILICON FILMS DEPOSITED BY RAPID THERMAL LPCVD

Mitchell, S. J. N., McNeil, D. W., Raza, S. H., Armstrong, B. M., Gamble, H. S.

Materials Research Society
3 Conference Proceedings Germanium Bonding to AL2O3

P.T. Baine, H. Gamble, B. Armstrong, S.J.N. Mitchell, D. McNeill

Electrochemical Society
9 Conference Proceedings Fabrication and characterisation of Silicon On Insulator substrates incorporating thermal vias.

Bain, M.F., Baine, P., McNeill, D.W., Srinivasan, G., Jankovic, N., McCartney, J., Moore, R.A., Armstrong, B.M., Gamble, …

Kluwer Academic Publishers
4 Conference Proceedings Fabrication of sub-micron active layer SSOI substrates using ion splitting and wafer bonding technologies

Ruddell, F.H., Rain, M.F., Suder, S., Hurley, R.E., Armstrong, R.M., Fusco, V.F., Gamble, H.S.

Electrochemical Society
10 Conference Proceedings Encroachment on Silicon Substrate by PECVD Deposited Tungsten at Low Temperatures and the Effect of WF5 on Selectivity

Bain, M.F., Armstrong., B.M., Gamble, H.S.

Electrochemical Society
5 Conference Proceedings Production of silicon diaphragms by precision grinding

Prochaska,A., Baine,P.T., Mitchell,S.J.N., Gamble,H.S.

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Polish Stop Formation for Sub-Micron SOI

Gay, D.L., Tweedie, M., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
6 Conference Proceedings SPICE modeling of liquid capacitance in micromachined silicon capillaries

Rainey,P.V., Mitchell,S.J.N., Gamble,H.S.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings SOI Production using Polish Stops Formed by Trench before Bond Techniques

Gay, D.L., Baine, P.T., Armstrong, B.M., Gamble, H.S.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12