Improvement of metal photo process margin with OPC and CMP for 0.14-μm DRAM technology node and beyond
- Author(s):
Bae,D. ( Samsung Electronics Co., Ltd. ) Bae,J.-S. Sung,S.-W. Park,J.-S. Rhie,S.-U. Shin,D.-W. Chung,T.-Y. Kim,K. - Publication title:
- Optical Microlithography XIV
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4346
- Pub. Year:
- 2001
- Vol.:
- 4346
- Pt.:
- Two of Two Parts
- Page(from):
- 1451
- Page(to):
- 1461
- Pages:
- 11
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819440327 [0819440329]
- Language:
- English
- Call no.:
- P63600/4346
- Type:
- Conference Proceedings
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