Through-hole Plugs and Thermal Vias
- Author(s):
- Crumpton,John C. ( DuPont i Technologies )
- Cofield,Victoria E.
- Bacher,Rudolph J.
- Publication title:
- Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4339
- Pub. Year:
- 2000
- Page(from):
- 325
- Page(to):
- 329
- Pages:
- 5
- Pub. info.:
- Reston, VA: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815622 [0930815629]
- Language:
- English
- Call no.:
- P63600/4339
- Type:
- Conference Proceedings
Similar Items:
IMAPS |
7
Conference Proceedings
Via Failures in a Plug Process Due to Incomplete Via Clean Chemistry Removal
Electrochemical Society |
IMAPS, SPIE-The International Society for Optical |
Materials Research Society |
IMAPS |
SPIE-The International Society for Optical Engineering |
4
Conference Proceedings
Internal Cooling Near Trailing Edge of a Gas Turbine Airfoil With Cooling Airflow Through Blockages With Holes
American Society of Mechanical Engineers |
10
Conference Proceedings
“New” Advanced Digital Vibration Welder to Weld Thermoplastic Assemblies (890)
Society of Plastic Engineers. |
IMAPS |
MRS-Materials Research Society |
SPIE-The International Society for Optical Engineering |
12
Conference Proceedings
PLUGGING OF A1 FILMS INTO SUBMICRON DIAMETER VIA HOLES BY EXCIMER LASER IRRADIATION
Materials Research Society |