Ablation and cleaning of wafer surface by excimer laser
- Author(s):
- Publication title:
- Laser Applications in Microelectronic and Optoelectronic Manufacturing VI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4274
- Pub. Year:
- 2001
- Page(from):
- 9
- Page(to):
- 17
- Pages:
- 9
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819439529 [0819439525]
- Language:
- English
- Call no.:
- P63600/4274
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Laser cleaning technology of the contact hole for semiconductor manufacturing
SPIE - The International Society of Optical Engineering |
7
Conference Proceedings
Analysis of mechanical characteristics of the ionic polymer metal composite (IPMC) actuator using cast ion-exchange film
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
8
Conference Proceedings
Novel cleaning techniques to achieve defect-free photomasks for sub-65-nm nodes [6349-109]
SPIE - The International Society of Optical Engineering |
3
Conference Proceedings
Pulsed laser cleaning of sub- and micron-size contaminant particles from optical surfaces: cleaning versus ablation and damage [5991-52]
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |
4
Conference Proceedings
Capability of eco-friendly cleaning strategy corresponding to advanced technology
Society of Photo-optical Instrumentation Engineers |
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Nd:YAG laser cleaning of ablation debris from excimer-laser ablated polymide
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |