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CVD Cu/IMP Cu/TaN/SiO2/Si structures

Author(s):
Publication title:
Microelectronic Yield, Reliability, and Advanced Packaging
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4229
Pub. Year:
2000
Page(from):
176
Page(to):
182
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819439017 [0819439010]
Language:
English
Call no.:
P63600/4229
Type:
Conference Proceedings

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