Blank Cover Image

Fast yield learning using e-beam wafer inspection

Author(s):
Garvin,J.
Guldi,R.L.
Sridhar,N.
Tinker,M.
Cappel,R.
Cass,T.
Roberts,J.
2 more
Publication title:
Microelectronic Yield, Reliability, and Advanced Packaging
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4229
Pub. Year:
2000
Page(from):
85
Page(to):
91
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819439017 [0819439010]
Language:
English
Call no.:
P63600/4229
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Comprehensive methodology for integrated circuit in-line defect classification

Guldi,R.L., Paradis,D.E., Sridhar,N., Hightower,J.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings High throughput measurement techniques for wafer level yield inspection of MEMS devices

O. Varela Pedreira, T. Lauwagie, J. De Coster, L. Haspeslagh, A. Witvrouw

Society of Photo-optical Instrumentation Engineers
2 Conference Proceedings Die-counting algorithm for yield modeling and die-per-wafer optimization

Croft,G.D., Lomenick,R.L., Youngblood,D.L., Johnston,J.M.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Accelerated yield learning in agressive lithography

Monahan,K.M., Ashkenaz,S.M., Chen,X., Lord,P.J., Merrill,M.A., Quattrini,R., Wiley,J.N.

SPIE - The International Society for Optical Engineering
3 Conference Proceedings Improved defect detection performance at metal and contact etch levels using a new optical-comparison segmented-autothreshold technology

Garvin,J.F., Keefauver,K., Tinker,M.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings High-power ultra-fast single- and multi-mode quantum dot lasers with superior beam profile

Sellin, R.L., Bimberg, D.H., Ustinov, V.M., Ledentsov, N.N., Kaiander, I.N., Kuntz, M., Lymmlin, M., Tan, K.T., …

SPIE - The International Society of Optical Engineering
4 Conference Proceedings INVESTIGATION OF S/D DISLOCATIONS AND ELECTRICAL LEAKAGE IN SILICON CMOS INTEGRATED CIRCUITS

Guldi, R.L.

Electrochemical Society
10 Conference Proceedings Etch process monitoring by electron beam wafer inspection

L. Lin, J. Chen, W. Wong, M. McCord, A. Tsai, S. Oestreich, I. De, J. Lauber, A. Kang

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Fast Inspection of Non-Visual Defects in the Wafer Surface Using Two Low-Energy E-Beam Sources

S.J. Ahn, T.S. Oh, D.W. Kim, H.S. Kim

Trans Tech Publications
11 Conference Proceedings Study of ADI (After Develop Inspection) on photo resist wafers using electron beam (II)

T. Hayashi, M. Saito, K. Fujihara, S. Shibuya, Y. Kudou, H. Nagaike, J. Lin, J. Jau

SPIE - The International Society of Optical Engineering
6 Conference Proceedings Yield,metrology,and inspection characteristics of SCALPEL masks

Peabody,M.L., Blakey,M.I., Farrow,R.C., Kasica,R.J., Liddle,J.A., Novembre,A.E., Saunders,T.E., Tennant,D.M., Windt,D.L.

SPIE-The International Society for Optical Engineering
12 Conference Proceedings *USING FAST AND SENSITIVE PAITERNED WAFER DEFECT DETECTION TOOLS AND FAST DEFECT DATA ANALYSIS IN YIELD ENHANCEMENT PROGRAMS

Satterfield, M.J., Alvis, J.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12