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Model of dislocations at the interface of bonded wafers

Author(s):
Han,W.
Yu,J.
Wang,L.
Wei,H.
Zhang,X.
Wang,Q.
1 more
Publication title:
Optical interconnects for telecommunication and data communications, 8-10 November 2000, Beijing, China
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4225
Pub. Year:
2000
Page(from):
116
Page(to):
119
Pages:
4
Pub. info.:
Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819438966 [0819438960]
Language:
English
Call no.:
P63600/4225
Type:
Conference Proceedings

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