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Development of Thermal Solution for High Power Flip Chip CPU Package

Author(s):
Kwon,H.K.
Baek,J.H.
Chun,J.W.
Kim,M.H.
Lee,T.K.
Oh,S.Y.
Ro,Y.H.
2 more
Publication title:
2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4217
Pub. date:
2000
Vol.:
4217
Page(from):
313
Page(to):
319
Pages:
7
Pub. info.:
Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
ISSN:
0277786X
ISBN:
9780930815608 [0930815602]
Language:
English
Call no.:
P63600/4217
Type:
Conference Proceedings

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