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Investigation on bridge in QFP and fatigue in BGA based on simulating solder joint formation

Author(s):
Publication title:
Intelligent systems in design and manufacturing
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4192
Pub. Year:
2000
Page(from):
222
Page(to):
227
Pages:
6
Pub. info.:
Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819438577 [081943857X]
Language:
English
Call no.:
P63600/4192
Type:
Conference Proceedings

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