Blank Cover Image

Fast wafer-level detection and control of interconnect reliability

Author(s):
Publication title:
Process Control and Diagnostics
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4182
Pub. Year:
2000
Page(from):
166
Page(to):
177
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819438430 [081943843X]
Language:
English
Call no.:
P63600/4182
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Optimization of passive piezoelectric vibration shunt control based on strain energy transfer and online frequency detection [6167-66]

Cao, J. L., John, S., Molyneaux, T.

SPIE - The International Society of Optical Engineering
7 Conference Proceedings Optical Interconnect Components for Wafer Level Heterogeneous Hyper-Integration

Persans, P.D., Ojha, M., Gutmann, R.J., Lu, J.-Q., Filin, A., Plawsky, J.

Materials Research Society
2 Conference Proceedings Practical application of a wafer-level reliability control program

J.S. May, A.K. Duong, J. Saenz, H.H. Hoang

Society of Photo-optical Instrumentation Engineers
8 Conference Proceedings Reliability Studies of Cu Using Wafer Level Joule Heated Electromigration Test

Low, K. S., Hans, P., O'Neill, A.

MRS - Materials Research Society
3 Conference Proceedings Piezoelectric-based vibration control optimization in nonlinear wood and composite structures

Cao, J. L., John, S., Molyneaux, T.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Solving production process challenges with wafer-level reliability techniques

Shideler,J., Reedholm,J., Yarling,C.B.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Failure analysis of wafer-level reliability testing failure

Oh,C.K., Neo,S.P., Bi,J.H., Wu,Z.M., Goh,L.C., Redkar,S.

SPIE - The International Society for Optical Engineering
10 Conference Proceedings Evaluation of the Electromigration Performance of New Aluminum Via Plug-Fill Techniques for 0.25ｦﾌm and 0.18ｦﾌm Technologies

Foley, S., Tung, N. Chan, Gounelle, C., Wyborn, G., Louwers, S., Mathewson, A.

MRS - Materials Research Society
5 Conference Proceedings Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects

Lu, J.-Q., Jindal, A., Kwon, Y., McMahon, J.J., Lee, K.-W., Kraft, R.P., Altemus, B., Cheng, D., Eisenbraun, E., Cale, …

Electrochemical Society
11 Conference Proceedings Assembly and Reliability of a Wafer Level CSP

Patel, Parvez M., Primavera, Anthony, Srihari, K.

IMAPS
6 Conference Proceedings Circuit-Level And Layout-Specific Interconnect Reliability Assessments

Hau-Riege, S.P., Thompson, C.V., Hau-Riege, C.S., Andleigh, V.K., Chery, Y., Troxel, D.

Materials Research Society
12 Conference Proceedings The Influence of Grain Structure on the Reliability of Narrow Al-Based Interconnects

Kang, S. H., Kim, C., Genin, F. Y., Morris, J. W., Jr.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12