Inspection of ball grid array(BGA)solder joints using x-ray cross-sectional images

Inspection of ball grid array(BGA)solder joints using x-ray cross-sectional images

Author(s):

Roh,Y.J. ( Korea Advanced Institute of Science and Technology )

Publication title:

Machine vision systems for inspection and metrology VIII : 21-22 September 1999, Boston, Massachusetts

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3836

Pub. Year:

1999

Page(from):

168

Page(to):

178

Pub. info.:

Bellingham, Wash.: SPIE - The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819434296 [0819434299]

Language:

English

Call no.:

P63600/3836

Type:

Conference Proceedings

Details

TDL ID:	ZA00020881
Series ID:	PA00000029
Conf. info. (Name):	Photonics East : Machine Vision Systems for Inspection and Metrology
Conf. info. (Number):	1999 : 8th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1999.09.21-1999.09.22

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