Wirebonding for Multichip Modules

Wirebonding for Multichip Modules

Author(s):

Charles,Harry K.,Jr. ( The Johns Hopkins University APL )
Mach,K.J.
Edwards,R.L.
Lehtonen,S.J.

Publication title:

1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2920

Pub. Year:

1996

Page(from):

420

Page(to):

425

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780930815486 [0930815483]

Language:

English

Call no.:

P63600/2920

Type:

Conference Proceedings

Details

TDL ID:	ZA00020753
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	1996
Conf. info. (Venue):	Minneapolis, Minnesota, USA
Conf. info. (Date):	1996.10.08-1996.10.10

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