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Post-Cure Die Attach Delamination

Author(s):
Publication title:
1996 International Symposium on Microelectronics : 8-10 October 1996, Minneapolis Convention Center, Minneapolis, Minnesota
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
2920
Pub. date:
1996
Page(from):
162
Page(to):
167
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815486 [0930815483]
Language:
English
Call no.:
P63600/2920
Type:
Conference Proceedings

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