Assembly and interconnection technology for micromechanical structures using anisotropic conductive film

Assembly and interconnection technology for micromechanical structures using anisotropic conductive film

Author(s):

Kang,I.-B. ( Univ.of South Australia )
Haskard,M.R.
Ju,B.K.

Publication title:

Micromachining and microfabrication process technology II : 14-15 October, 1996, Austin, Texas

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2879

Pub. Year:

1996

Page(from):

280

Page(to):

287

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819422774 [0819422770]

Language:

English

Call no.:

P63600/2879

Type:

Conference Proceedings

Details

TDL ID:	ZA00020749
Series ID:	PA00000029
Conf. info. (Name):	Micromachining and Microfabrication : Micromachining and Microfabrication Process Technology
Conf. info. (Number):	1996 : 2nd
Conf. info. (Venue):	Austin, TX, USA
Conf. info. (Date):	1996.10.14-1996.10.15

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