Computer-Aided Investigation of Grain Growth in Copper and Aluminium

Computer-Aided Investigation of Grain Growth in Copper and Aluminium

Author(s):

Publication title:

Grain growth in polycrystalline materials : proceedings of the 1st International Conference on Grain Growth in Polycrystalline Materials, held in Rome, Italy, 18-21 June, 1991

Title of ser.:

Materials science forum

Ser. no.:

94-96

Pub. Year:

1992

Vol.:

Pt.2

Page(from):

765

Page(to):

770

Pub. info.:

Zurich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878496402 [0878496408]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00020686
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Grain Growth in Polycrystalline Materials
Conf. info. (Number):	1st
Conf. info. (Venue):	Rome, Italy
Conf. info. (Date):	1991.06.18-1991.06.21

Similar Items:

1 Conference Proceedings Computer-Aided Investigation of Isothermal Grain Growth in Copper and Brass Vogel,S., Klimanek,P. Trans Tech Publications	7 Conference Proceedings Recrystallization and Grain Growth in Aluminium and Copper Bicrystals Kikuchi,S. Trans Tech Publications
2 Conference Proceedings Three-Dimensional Monte Carlo Simulation of Primary Recrystallization and Grain Growth in Metals with Texture Mehnert,K., Klimanek,P. Trans Tech Publications	8 Conference Proceedings Computer Simulation of Grain Growth in Particle Dispersed Structure Ohnuma,I., Ohtani,H., Ishida,K., Nishizawa,T. Trans Tech Publications
3 Conference Proceedings Grain-size determination by means of X-ray and neutron high-angle diffraction Klimanek,P. Trans Tech Publications	9 Conference Proceedings Effect of Strain-Induced Grain Growth on Flow Stress in Superplastic Aluminium Alloy Iwasaki,H., Hayami,S., Higashi,K., Tanimura,S. Trans Tech Publications
4 Conference Proceedings Investigation of Passive Layer Properties on Nanocrystalline Nickel by Electrochemical Impedance Spectroscopy Schneider, M., Pischang, K., Worch, H., Fritsche, G., Klimanek, P. Trans Tech Publications	10 Conference Proceedings X-ray substructure analysis in galvanic copper coatings deposited at different bath temperatures Weidner,H., Klimanek,P., Baumgartner,E., Raub,Ch.J. Trans Tech Publications
5 Conference Proceedings Global Texture Development in Cold Work of Copper and Brass by Pass Rolling Schneider,H., Klimanek,P., Brokmeier,H.-G. Trans Tech Publications	11 Conference Proceedings Dynamic Grain Growth in Superplastic and Non-Superplastic Aluminium Alloys Bate, P.S., Hyde, K.B., Court, S.A., Humphreys, F.J. Trans Tech Publications
6 Conference Proceedings Diffraction Analysis of Microtexture Development in Plastically Deformed Copper Haberjahn, M., Klimanek, P. Trans Tech Publications	12 Conference Proceedings Textures of Thin Films Oettel,H., Klimanek,P. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12