New method for grafting a thin film metal-semiconductor-metal photodetector with a transimpedence amplifier and applications to multichip module packaging

New method for grafting a thin film metal-semiconductor-metal photodetector with a transimpedence amplifier and applications to multichip module packaging

Author(s):

Morrison,C.B. ( TACAN Corp. )
Zhu,Z. ( TACAN Corp. )
Steinberg,J. ( TACAN Corp. )
Glinz,A.P. ( TACAN Corp. )
Bechtel,J.H. ( TACAN Corp. )

Publication title:

Optoelectronic Interconnects V

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3288

Pub. Year:

1998

Page(from):

16

Page(to):

22

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819427274 [0819427276]

Language:

English

Call no.:

P63600/3288

Type:

Conference Proceedings

Details

TDL ID:	ZA00020646
Series ID:	PA00000029
Conf. info. (Name):	Photonics West : Optoelectronic Interconnects
Conf. info. (Number):	1998 : 5th
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	1998.01.28-1998.01.29

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