MEMS packaging: state of the art and future trends (Invited Paper)

MEMS packaging: state of the art and future trends (Invited Paper)

Author(s):

Bossche,A. ( Delft Univ.of Technology (Netherlands) )
Cotofana,C.B.V. ( Delft Univ.of Technology (Netherlands) )
Mollinger,J.R. ( Delft Univ.of Technology (Netherlands) )

Publication title:

Smart structures and materials 1998 : smart electronics and MEMS : 2-4 March 1998, San Diego, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3328

Pub. Year:

1998

Page(from):

166

Page(to):

173

Pub. info.:

Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819427724 [0819427721]

Language:

English

Call no.:

P63600/3328

Type:

Conference Proceedings

Details

TDL ID:	ZA00020642
Series ID:	PA00000029
Conf. info. (Name):	Smart Structures and Materials
Conf. info. (Number):	1998
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.03.02-1998.03.04

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