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Finite element analysis of thermal stresses in laser packaging

Author(s):
Sheen,M.-T. ( National Sun Yat-Sen Univ.(Taiwan) )
Chen,C.-H. ( National Sun Yat-Sen Univ.(Taiwan) )
Kuang,J.-H. ( National Sun Yat-Sen Univ.(Taiwan) )
Cheng,W.-H. ( National Sun Yat-Sen Univ.(Taiwan) )
Chang,H.-L. ( Chunghwa Telecom Labs. (Taiwan) )
Wang,S.-C. ( Chunghwa Telecom Labs. (Taiwan) )
Wang,C. ( Chunghwa Telecom Labs. (Taiwan) )
Wang,C.-M. ( Chunghwa Telecom Labs. (Taiwan) )
Liaw,J.-W. ( Chunghwa Telecom Labs. (Taiwan) )
4 more
Publication title:
Optoelectronic Materials and Devices
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3419
Pub. Year:
1998
Page(from):
93
Page(to):
101
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819428738 [0819428736]
Language:
English
Call no.:
P63600/3419
Type:
Conference Proceedings

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