Evaluation of Epoxy Underfill Materials for Use in "Chip-on-Board" Method of Packaging Silicon Integrated Circuits
- Author(s):
- Park E. C. ( University of Science and Technology )
- Raju R. V. ( AT&T Bell Labs )
- Bair E. H. ( AT&T Bell Labs )
- Han J. B. ( AT&T Bell Labs )
- Publication title:
- ANTEC 95, Boston, May 7-11, Boston : The plastics challenge - a revolution in education : Volume II. Materials
- Title of ser.:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- Ser. no.:
- 41(2)
- Pub. Year:
- 1995
- Vol.:
- 2
- Page(from):
- 2871
- Page(to):
- 2876
- Pages:
- 6
- Pub. info.:
- Brookfield, CT: Society of Plastics Engineers, Inc. (SPE)
- ISBN:
- 9781566763196 [1566763193]
- Language:
- English
- Call no.:
- S42700/962602
- Type:
- Conference Proceedings
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