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Evaluation of Epoxy Underfill Materials for Use in "Chip-on-Board" Method of Packaging Silicon Integrated Circuits

Author(s):
Publication title:
ANTEC 95, Boston, May 7-11, Boston : The plastics challenge - a revolution in education : Volume II. Materials
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
41(2)
Pub. Year:
1995
Vol.:
2
Page(from):
2871
Page(to):
2876
Pages:
6
Pub. info.:
Brookfield, CT: Society of Plastics Engineers, Inc. (SPE)
ISBN:
9781566763196 [1566763193]
Language:
English
Call no.:
S42700/962602
Type:
Conference Proceedings

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