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SPFM Precleaning for Formation of Silicon Interfaces by Wafer Bonding

Author(s):
Publication title:
Science and technology of semiconductor surface preparation : symposium held April 1-3, 1997, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
477
Pub. Year:
1997
Page(from):
267
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993815 [1558993819]
Language:
English
Call no.:
M23500/477
Type:
Conference Proceedings

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