Refractive indices in thick photoresist films as a function of bake conditions and film exposure

Refractive indices in thick photoresist films as a function of bake conditions and film exposure

Author(s):

Publication title:

Advances in resist technology and processing XIV : 10-12 March 1997, Santa Clara, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3049

Pub. Year:

1997

Page(from):

838

Page(to):

849

Pub. info.:

Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819424631 [0819424633]

Language:

English

Call no.:

P63600/3049

Type:

Conference Proceedings

Details

TDL ID:	ZA00020295
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in resist technology and processing
Conf. info. (Number):	1997 : 14th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	1997.03.10-1997.03.12

Similar Items:

1 Conference Proceedings Development of two new thick-film photoresists Ficner,S.A., Hermanowski,J., Lu,P.-H., Kokinda,E., Perez,Y.M., Dammel,R.R. SPIE-The International Society for Optical Engineering	7 Conference Proceedings Photoresist materials:a historical perspective Willson,C.G., Dammel,R.R., Reiser,A. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Photoresist characterization for lithography simulation:II.Exposure parameter measurements Henderson,C.L., Pancholi,S., Chowdhury,S.A., Willson,C.G., Dammel,R.R. SPIE-The International Society for Optical Engineering	8 Conference Proceedings Photoresist materials:a historical perspective Willson,C.G., Dammel,R.R., Reiser,A. SPIE-The International Society for Optical Engineering
3 Conference Proceedings Modeling parameter extraction for DNQ-novolak thick film resists Henderson,C.L., Scheer,S.A., Tsiartas,P.C., Rathsack,B.M., Sagan,J.P., Dammel,R.R., Erdmann,A., Willson,C.G. SPIE-The International Society for Optical Engineering	9 Conference Proceedings Photoresist materials:a historical perspective Willson,C.G., Dammel,R.R., Reiser,A. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Resist rehydration during thick film processing Lehar,O.P., Spak,M.A., Meyer,S., Dammel,R.R., Brodsky,C.J., Willson,C.G. SPIE-The International Society for Optical Engineering	10 Conference Proceedings Some aspects of thick film resist performance and modeling Erdmann,A., Henderson,C.L., Willson,C.G., Dammel,R.R. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Improved simulation of photoresists using new development models Dammel,R.R., Sagan,J.P., Kokinda,E., Eilbeck,N., Mack,C.A., Arthur,G.G., Henderson,C.L., Scheer,S.A., Rathsack,B.M., … SPIE-The International Society for Optical Engineering	11 Conference Proceedings Diffusivity measurements in polymers:I.Lithographic modeling results Mack,C.A., Mueller,K.E., Gardiner,A.B., Qin,A., Dammel,R.R., Koros,W.J., Willson,C.G. SPIE-The International Society for Optical Engineering
6 Conference Proceedings Photoresist materials:a historical perspective Willson,C.G., Dammel,R.R., Reiser,A. SPIE-The International Society for Optical Engineering	12 Conference Proceedings Photoresist characterization for lithography simulation:III.Development parameter measurements Henderson,C.L., Tsiartas,P.C., Pancholi,S., Chowdhury,S.A., Dombrowski,K.D., Willson,C.G., Dammel,R.R. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12