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Influence of Grain Boundary Structure on Bubble Formation Behaviour in Helium Implanted Copper

Author(s):
Publication title:
Intergranular and interphase boundaries in materials : iib95 : proceedings of the 7th International Conference on Intergranular and Interphase Boundaries in Materials held in Lisboa, Portugal, June 26-29, 1995
Title of ser.:
Materials science forum
Ser. no.:
207-209
Pub. Year:
1996
Pt.:
2
Page(from):
445
Page(to):
448
Pub. info.:
Zurich-Uetikon, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878497225 [0878497226]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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