Improved post-etch cleaning of dual-damascene system for 0.18-ヲフm technology
- Author(s):
Louis,D. ( CEA-LETI (France) ) Peyne,C. ( EKC Technology,Inc. ) Lajoinie,E. ( SGS-Thomson (France) ) Vallesi,B. ( SGS-Thomson (France) ) Maloney,D.J. ( EKC Technology,Inc. ) Lee,S. ( EKC Technology,Inc. ) - Publication title:
- Multilevel Interconnect Technology II
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3508
- Pub. Year:
- 1998
- Page(from):
- 162
- Page(to):
- 169
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819429674 [0819429678]
- Language:
- English
- Call no.:
- P63600/3508
- Type:
- Conference Proceedings
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