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Improved post-etch cleaning of dual-damascene system for 0.18-ヲフm technology

Author(s):
Louis,D. ( CEA-LETI (France) )
Peyne,C. ( EKC Technology,Inc. )
Lajoinie,E. ( SGS-Thomson (France) )
Vallesi,B. ( SGS-Thomson (France) )
Maloney,D.J. ( EKC Technology,Inc. )
Lee,S. ( EKC Technology,Inc. )
1 more
Publication title:
Multilevel Interconnect Technology II
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3508
Pub. Year:
1998
Page(from):
162
Page(to):
169
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819429674 [0819429678]
Language:
English
Call no.:
P63600/3508
Type:
Conference Proceedings

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