Introduction to 300-mm/0.18-ｦﾌm to 0.13-ｦﾌm clean CMP system

Introduction to 300-mm/0.18-ｦﾌm to 0.13-ｦﾌm clean CMP system

Author(s):: Tsujimura,M. ( Ebara Corp. (Japan) )
Publication title:: Multilevel Interconnect Technology II
Title of ser.:: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:: 3508
Pub. Year:: 1998
Page(from):: 134
Page(to):: 145
Pub. info.:: Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:: 0277786X
ISBN:: 9780819429674 [0819429678]
Language:: English
Call no.:: P63600/3508
Type:: Conference Proceedings

Details

TDL ID:	ZA00020162
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Multilevel Interconnect Technology
Conf. info. (Number):	1998 : 2nd
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	1998.09.23-1998.09.24

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