0.50-ｦﾌm pitch metal integration in 0.18-ｦﾌm technology

0.50-ｦﾌm pitch metal integration in 0.18-ｦﾌm technology

Author(s):

DeBord,J.R.D. ( Texas Instruments Inc. )
Jayaraman,V. ( Texas Instruments Inc. )
Hewson,M.M. ( Texas Instruments Inc. )
Lee,W.W. ( Texas Instruments Inc. )
Ilzhoefer,J.R. ( Texas Instruments Inc. )

Publication title:

Multilevel Interconnect Technology II

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3508

Pub. Year:

1998

Page(from):

104

Page(to):

109

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819429674 [0819429678]

Language:

English

Call no.:

P63600/3508

Type:

Conference Proceedings

Details

TDL ID:	ZA00020162
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Multilevel Interconnect Technology
Conf. info. (Number):	1998 : 2nd
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	1998.09.23-1998.09.24

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