Mechanical properties of electroplated copper thin films

Mechanical properties of electroplated copper thin films

Author(s):

Spolenak, R.

Publication title:

Thin films - stresses and mechanical properties VIII : symposium held November 29-December 3, 1999, Boston, Massachusetts, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

594

Pub. Year:

2000

Page(from):

63

Pub. info.:

Warrendale, Pa.: MRS-Materials Research Society

ISSN:

02729172

ISBN:

9781558995024 [1558995021]

Language:

English

Call no.:

M23500/594

Type:

Conference Proceedings

Details

TDL ID:	ZA00019897
Series ID:	PA00000011
Conf. info. (Name):	Thin Films-Stresses and Mechanical Properties : Symposium
Conf. info. (Number):	8th
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1999.11.29-1999.12.03

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