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THE EFFECT OF Cu ALLOYING ON Al ALLOY THIN FILMS: MICROSTRUCTURAL MECHANISMS THAT ENHANCE ELECTROMIGRATION RESISTANCE

Author(s):
Publication title:
Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
309
Pub. Year:
1993
Page(from):
359
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992054 [1558992057]
Language:
English
Call no.:
M23500/309
Type:
Conference Proceedings

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