EFFECT OF TiN ANNEAL AMBIENT ON THE MICROSTRUCTURE AND ELECTROMIGRATION PERFORMANCE OF Al-BASED ALLOYS

EFFECT OF TiN ANNEAL AMBIENT ON THE MICROSTRUCTURE AND ELECTROMIGRATION PERFORMANCE OF Al-BASED ALLOYS

Author(s):

Olowolafe, J. Olufemi

Publication title:

Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

309

Pub. Year:

1993

Page(from):

95

Pub. info.:

Pittsburgh, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558992054 [1558992057]

Language:

English

Call no.:

M23500/309

Type:

Conference Proceedings

Details

TDL ID:	ZA00019851
Series ID:	PA00000011
Conf. info. (Name):	Symposium on materials reliability in microelectronics
Conf. info. (Number):	3rd
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1993.04.12-1993.04.15

Similar Items:

1 Conference Proceedings Effect of Poly-Si on Electromigration Behaviors and Microstructure Characteristics of Au Metallization Lee, T., York, B. R., Lindgren, B., Kentzinger, H., Lee, J., Christenson, C., Varker, C., Evans, K. MRS - Materials Research Society	7 Conference Proceedings The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects Besser, Paul R., Sanchez, John E., Jr., Field, David P., Pramanick, Shekhar, Sahota, Kashmir MRS - Materials Research Society
2 Conference Proceedings Effect of Annealing and Passivation on the Electromigration and Linewidth Dependence Carnes, R. O., Lee, C. H., Keating, P. T., Barrall, E. M., II., York, B. R., Grivna, G. M., Bauguess, S. W., Dreyer, M. … MRS - Materials Research Society	8 Conference Proceedings Effect of Ce and Homogeneous Annealing on Microstructure and Deformation Performance of ZM21 Alloy Q. Li, W.B. Zhu, S.Y. Wang, X.Q. Jiang, F.S. Pan Trans Tech Publications
3 Conference Proceedings Effect of Tin on the Microstructures and Mechanical Properties ofa Au-Pt-Cu Alloy Kim, M.H., Lee, S.H., Lim, H.N., Doh, J.M., Baik, H.G. Trans Tech Publications	9 Conference Proceedings Microstructure of Oxidized Ge0.78Si0.12 Annealed in a Reducing Ambient Theodore, N. D., Liu, W. S., Lie, D. Y. C., Cams, T. K., Wang, K. L. MRS - Materials Research Society
4 Conference Proceedings The Effect of Test Structure and Stress Condition on Electromigration Failure Kawasaki, H., Lee, C., Pintchovski, F. Electrochemical Society	10 Conference Proceedings *FABRICATION OF PLATINUM-GOLD ALLOYS IN PRE-HISPANIC SOUTH AMERICA: ISSUES OF TEMPERATURE AND MICROSTRUCTURE CONTROL Handwerker, Carol A., Lechtman, Heather N., Marinenko, Ryna B., Bright, David S., Newburry, Dale E. Materials Research Society
5 Conference Proceedings Effect of ambient temperature on the performance of shape memory alloy seismic devices Andrawes, B., DesRoches, R. SPIE - The International Society of Optical Engineering	11 Conference Proceedings Electromigration performance improvement of Al-Si-Cu/TiN/Ti/n+Si contact Shi,G., Sun,Z., Xu,G.-F., Min,Y.-H., Luo,J.-Y., Lu,Y., Li,B.-Z., Qu,X.-P., Qian,G., Doan,M.T., Lee,E. SPIE-The International Society for Optical Engineering
6 Conference Proceedings The Microstructure and Electromigration Performance of Damascene-Fabricated Aluminum Interconnects Besser, Paul R., Sanchez, John E., Jr., Field, David P., Pramanick, Shekhar, Sahota, Kashmir MRS - Materials Research Society	12 Conference Proceedings Components of variance in ROC analysis of CADx classifier performance Wagner,R.F., Chan,H.-P., Mossoba,J.T., Sahiner,B., Petrick,N. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12