Characterization of Thin Dielectric Films as Copper Diffusion Barriers Using Triangular Voltage Sweep
- Author(s):
Cohen, S. A. Liu, J. Gignac, L. Ivers, T. Armbrust, D. Rodbell, K. P. Gates, S. M. - Publication title:
- Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 564
- Pub. Year:
- 1999
- Page(from):
- 551
- Pub. info.:
- Warrendale, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994713 [1558994718]
- Language:
- English
- Call no.:
- M23500/564
- Type:
- Conference Proceedings
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