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Improved Al-Via Fill Process Technology for Sub-0.25 ヲフm Interconnect

Author(s):
Publication title:
Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
564
Pub. date:
1999
Page(from):
437
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994713 [1558994718]
Language:
English
Call no.:
M23500/564
Type:
Conference Proceedings

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