Improved Al-Via Fill Process Technology for Sub-0.25 ｦﾌm Interconnect

Improved Al-Via Fill Process Technology for Sub-0.25 ｦﾌm Interconnect

Author(s):

Publication title:

Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

564

Pub. Year:

1999

Page(from):

437

Pub. info.:

Warrendale, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994713 [1558994718]

Language:

English

Call no.:

M23500/564

Type:

Conference Proceedings

Details

TDL ID:	ZA00019849
Series ID:	PA00000011
Conf. info. (Name):	Symposium on advanced interconnects and contacts
Conf. info. (Number):	1999
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	1999.04.05-1999.04.07

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