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CVD Cu Process Development and Integration for Sub-0.18 ｦﾌm Devices

Author(s):
Zhang, J.
Denning, D.
Braeckelmann, G.
Hamilton, G.
Lee, J. J.
Venkatraman, R.
Fiordalice, B.
Weitzman, E.
3 more
Publication title:
Advanced interconnects and contacts : symposium held April 5-7, 1999, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
564
Pub. Year:
1999
Page(from):
243
Pub. info.:
Warrendale, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994713 [1558994718]
Language:
English
Call no.:
M23500/564
Type:
Conference Proceedings

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