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Modelling of Failure Time Distributions for Interconnects Due to Stress Voiding and Electromigration

Author(s):
Wolfer, W. G.
Bartelt, M. C.
Dike, J. J.
Hoyt, J. J.
Gleixner, R. J.
Nix, W. D.
1 more
Publication title:
Materials reliability in microelectronics VIII : symposium held April 13-16, 1998, San Francisco, California, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
516
Pub. Year:
1998
Page(from):
147
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558994225 [155899422X]
Language:
English
Call no.:
M23500/516
Type:
Conference Proceedings

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