Sub-0.25-ｦﾌm defect analysis on 200-mm semiconductor wafers

Sub-0.25-ｦﾌm defect analysis on 200-mm semiconductor wafers

Author(s):

Childs,K.D. ( Physical Electronics,Inc. )
Paul,D.F.
Clough,S.P.

Publication title:

Metrology, Inspection, and Process Control for Microlithography X

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

2725

Pub. Year:

1996

Page(from):

255

Page(to):

260

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819421012 [0819421014]

Language:

English

Call no.:

P63600/2725

Type:

Conference Proceedings

Details

TDL ID:	ZA00019794
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology,Inspection, and Process Control for Microlithography
Conf. info. (Number):	1996 : 10th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	1996.03.11-1996.03.13

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