Development and production integration of a planarized AlCu interconnect process for submicron CMOS
- Author(s):
- Brown,K.C. ( National Semiconductor Corp. )
- Hill,R.
- Reddy,K.
- Gadepally,K.
- Publication title:
- Microelectronic Device and Multilevel Interconnection Technology
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 2636
- Pub. Year:
- 1995
- Page(from):
- 234
- Page(to):
- 243
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819420022 [0819420026]
- Language:
- English
- Call no.:
- P63600/2636
- Type:
- Conference Proceedings
Similar Items:
MRS - Materials Research Society |
Electrochemical Society |
Society of Photo-optical Instrumentation Engineers |
Materials Research Society |
SPIE-The International Society for Optical Engineering |
MRS - Materials Research Society |
SPIE - The International Society for Optical Engineering |
Materials Research Society |
5
Conference Proceedings
IMPACT OF VARIOUS POLYSILICON DEPOSITION PROCESS ON THIN GATE-OXIDE PROPERTIES IN SUBMICRON CMOS TECHNOLOGY
Materials Research Society |
11
Conference Proceedings
Sensor Development and Process Control for Chemical-Mechanical Planarization of Multilevel Interconnect Devices
Electrochemical Society |
6
Conference Proceedings
Alternative Low-Cost Process for the Hydrolysis of Lignocellulosic Materials for Bioethanol Production
American Institute of Chemical Engineers |
12
Conference Proceedings
Integration of CMOS process-compatible optoelectronic interconnects for high-speed communications (Invited Paper)
SPIE-The International Society for Optical Engineering |