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Contact potential difference methods for full wafer characterization of Si/Si02 interface defects induced by plasma processing (Invited Paper)

Author(s):
Edelman,P. ( Semiconductor Diagnostics,Inc. )
Savchouk,A. ( Semiconductor Diagnostics,Inc. )
Wilson,M. ( Semiconductor Diagnostics,Inc. )
Jastrzebski,L. ( Semiconductor Diagnostics,Inc. )
Lagowski,J.J. ( Semiconductor Diagnostics,Inc. )
Nauka,K. ( Hewlett-Packard Labs. )
Ma,S. ( Hewlett-Packard Labs. )
Hoff,A.M. ( Univ.of South Florida )
DeBusk,D.K. ( Cirent Semiconductor,Inc. )
4 more
Publication title:
In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing II :23-24 September 1998 Santa Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3509
Pub. date:
1998
Page(from):
126
Page(to):
136
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780081942963 [0081942968]
Language:
English
Call no.:
P63600/3509
Type:
Conference Proceedings

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